SK Hynix and TSMC Group Up for HBM4 Enchancment

SK hynix and TSMC launched early on Friday that that they’d signed a memorandum of understanding to collaborate on creating the next-generation HBM4 memory and superior packaging know-how. The initiative is designed to rush up the adoption of HBM4 memory and solidify SK hynix’s and TSMC’s primary positions in high-bandwidth memory and superior processor functions.

The primary focus of SK hynix’s and TSMC’s preliminary efforts will doubtless be to strengthen the effectivity of the HBM4 stack’s base die, which (if we put it very merely) acts like an ultra-wide interface between memory devices and host processors. With HBM4, SK hynix plans to utilize one in every of TSMC’s superior logic course of utilized sciences to assemble base dies to pack additional choices and I/O pins all through the confines of current spatial constraints.

This collaborative methodology moreover permits SK hynix to customize HBM choices to satisfy quite a few purchaser effectivity and energy effectivity requirements. SK hynix has been touting custom-made HBM choices for a while, and teaming up with TSMC will undoubtedly help with this.

“TSMC and SK hynix have already established a strong partnership via the years. Now we have labored collectively in integrating most likely probably the most superior logic and state-of-the paintings HBM in providing the world’s primary AI choices,” talked about Dr. Kevin Zhang, Senior Vice President of TSMC’s Enterprise Enchancment and Overseas Operations Office, and Deputy Co-Chief Working Officer. “Ready for the next-generation HBM4, we’re assured that we’ll proceed to work fastidiously in delivering the best-integrated choices to unlock new AI enhancements for our widespread shoppers.“

Furthermore, the collaboration extends to optimizing the mix of SK hynix’s HBM with TSMC’s CoWoS superior packaging know-how. CoWoS is among the many many hottest specialised 2.5D packaging course of utilized sciences for integrating logic chips and stacked HBM proper right into a unified module.

For now, it is anticipated that HBM4 memory will doubtless be built-in with logic processors using direct bonding. Nonetheless, a number of of TSMC’s shoppers may want to utilize an ultra-advanced mannequin of CoWoS to mix HBM4 with their processors.

“We anticipate a strong partnership with TSMC to help pace up our efforts for open collaboration with our shoppers and develop the enterprise’s best-performing HBM4,” talked about Justin Kim, President and the Head of AI Infra at SK hynix. “With this cooperation in place, we’re going to strengthen our market administration as the complete AI memory provider extra by beefing up competitiveness inside the home of the custom-made memory platform.“